Efficient Thermal Management in Processor Cooling Using Lauric Acid and Copper Foam-based PCM Composite
J. Environ. Nanotechnol., Volume 14, No 1 (2025) pp. 91-96
Abstract
Thermal management is critical in most industries to maintain optimal temperatures and improve system efficiency. This study focuses on creating a composite phase change material (PCM) using lauric acid (LA) and copper foam (CF) to enhance thermal management performance. Lauric acid was chosen because it melts at a practical temperature range (43–46℃) and has a high capacity to store and release energy during phase changes. Copper foam was added for its good thermal conductivity and porosity, thus allowing for an even distribution of heat and enhancement of the performance. The composite PCM gave promising results in terms of latent heat capacity (190 J/g) and thermal conductivity. Its properties make it suitable for applications such as cooling electronics, managing battery temperatures, and renewable energy systems. Testing confirmed stability and effectiveness. Structural stability was verified through XRD analysis. Differential Scanning Calorimetry cycling tests showed constant thermal performance across repeated heating and cooling cycles. Field Emission Scanning Electron Microscopy images showed that lauric acid was distributed uniformly in the copper foam allowing effective heat transfer. Thus, the composite can regulate temperature well, extend the lifetime of hardware, and show great potential for heat-dissipation. When compared with the lauric acid phase change alone, copper foam can decrease the time for a phase change to as low as 45%. Such an innovative material can bring about practical and effective solutions in the fields requiring efficient and reliable thermal management systems.
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